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Ceva Inc. (Nasdaq:CEVA); LSE:CVA), which licenses silicon intellectual property (SIP) platform solutions and DSP cores, today announced that its TeakLite-III DSP has been licensed by Toshiba Corporation.
The DSP will be used to power Toshiba's upcoming mobile audio chip and automotive audio DSP product lines. CEVA said that the TeakLite-III DSP will provide Toshiba with the most advanced and mature 32-bit audio DSP. CEVA added that the TeakLite-III DSP had also been named 'best all-around audio processor' in a comprehensive report on DSP cores by The Linley Group.
CEVA CEO Gideon Wertheizer said, "The addition of Toshiba to the growing list of CEVA customers leveraging our programmable DSPs and platforms is indicative of our continued expansion beyond cellular baseband to include the growing markets of high performance audio in mobile and automotive applications. By exploiting the programmability and flexibility of the CEVA-TeakLite-III, Toshiba can utilize the development resources effectively and maximize technology reuse across their mobile audio chip and automotive audio DSP product lines."
CEVA describes the TeakLite-III as a native 32-bit, high performance DSP core, used in cellular baseband and application processor chips, to handle, among other tasks, advanced mobile audio scenarios, such as multi-stream audio playback with various post-processing functions for enhanced audio experience.
CEVA's share price was down 2.96% in morning trading on Nasdaq today at $30.84, giving a market cap of $721.32 million.
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